CAPABILITIES
- for PCB (RIGID, FLEX/RIGID-FlEX), BACKPLANE, CHASSIS and SYSTEM ASSEMBLY
- Large-Format SMT (29" x 48")
- Through-Hole, SMT Soldering, Press-Fit and Hand Soldering
- Selective Soldering for Heavily Grounded Applications
- Selective Conformal Coating
- Mechanical Assembly and Test
- Anechoic Chamber for RF Testing (S Parameters)
- Introbotix Accuprober
- Automated X-Ray Solder Joint/Fill Verification
APPLICATIONS
- Defense
- Space
- Industrial
- Telcom
- Military/Commercial Aerospace