RIGID

Amphenol Printed Circuits is uniquely positioned to support high speed and high reliability rigid printed wiring boards. By matching materials with the most advanced processes to meet our customer's expectations, we continue to be a supplier of leading-edge interconnect technology. With production capabilities well beyond the industry standard for panel size, thickness, speed and technology, we are providing solutions to the most rigorous system demands of our customers. Collaborative relationships with our suppliers assures our ability to offer the experience necessary to remain current with laminates, processes and equipment while defining the path to the future.

Features and benefits

28 GHz Signals with line lengths in excess of 24

Low Loss, Low Dk, Smooth Copper
5% Tolerance Possible (Impedance)
Precision+ Backdrill
Small Drill Diameter/Thick Boards

CAPABILITIES

Laminates
Impedance Control
1 Dielectric Max Stub Length
High Aspect Ratio Plating

APPLICATIONS

Networking
Server Systems
Data Management and Strorage

BACKPLANES

Features and benefits

High reliability, performance targeted applications utilizing leading-edge technology and processes.

Polyimide, Epoxy, LCP, BT, PPO, Teflon and Hybrid Constructions
High Aspect Ratio Plating (> 25:1)
5% Tolerance Possible (Impedance)
60 Layers +

CAPABILITIES

Laminates
Plating
Impedance Control
Multilayer Constructions

APPLICATIONS

Satellite
Communications Systems
Munitions Control
Navigation

MIL/AERO

Features and benefits

High-density designs incorporating blind vias, buried vias, sequential lamination, via-in-pad, high aspect ratio plating

Thin dielectric materials (
HASL, ENIG, Immersion Tin, Immersion Silver
Up to 5X Lamination (material dependent)
Blind, buried and micro vias control stub length enhancing overall signal integrity

CAPABILITIES

Laminates
Surface Finish
Sequential Lamination
Impedance Control

APPLICATIONS

Digital Controls
High Density Digital Applications

HDI