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FLEX/RIGID-FLEX

In many cases, design constraints result in challenging obstacles when considering conventional wired solutions for interconnection within a system. Flex and rigid-flex circuitry offers many advantages when considering the most effective means to transmit signals or power within your system. Amphenol Printed Circuits supports all types of flex and rigid-flex circuitry and assemblies, from simple single sided flex to the most advanced rigid-flex assemblies and everything in between. Whether your system requires high-speed, high temperature, large form-factor or HDI, the Amphenol Advantage provides world class flex and rigid-flex capability supported by the most knowledgeable staff in the industry.



Features and benefits
  • Types 1 thru 5
  • Blind, buried and thru vias
  • Standard drill or laser micro-via
  • Broad material selection
  • Thru drill or backdrill
  • Controlled impedance
  • Various copper weights
  • Static or dynamic bend applications
CAPABILITIES
  • 30+ Layers
  • Multiple panel sizes
  • Flat or bookbinder
  • Sequential Lamination
  • All surface finishes supported
APPLICATIONS
  • Defense
  • Space
  • Industrial
  • Telcom
  • Military/Commercial Aerospace
Features and benefits
  • Types 1 thru 5
  • Dupont Pyralux AP, TK
  • LCP
  • All standard flex/rigid-flex technologies supported
  • Controlled impedance
  • Low profile copper
  • Various copper weights
  • Static or dynamic bend applications
CAPABILITIES
  • Up to 25 Gbps signal speeds
APPLICATIONS
  • Defense
  • Space
  • Industrial
  • Telcom
  • Military/Commercial Aerospace
Features and benefits
  • Types 1 thru 5
  • 24" X 36" standard panel size
  • All standard flex/rigid-flex technologies supported
  • Controlled impedance
  • Various copper weights
  • Static or dynamic bend applications
CAPABILITIES
  • Up to 24" X 54" panel size
APPLICATIONS
  • Defense
  • Space
  • Industrial
  • Telcom
  • Military/Commercial Aerospace
Features and benefits
  • All standard flex/rigid-flex technologies supported
  • Designed for densely packed applications
  • Static or dynamic bend applications
CAPABILITIES
  • Hi-Density Interconnect
APPLICATIONS
  • Defense
  • Space
  • Industrial
  • Telcom
  • Military/Commercial Aerospace