MANUFACTURING & MATERIALS CAPABILITIES

Parameter
Standard Advanced
Layer Count (aspect ratio driver) 1 - 30 30+
Minimum Drill Hole Size (mechanical) (mils) (aspect ratio dependent) 7.9 <7.9
Minimum Drill Hole Size (laser) (mils) (aspect ratio dependent) 4 4
Maximum Drill Hole Size (mechanical)(mils) (larger sizes are routed) .250 .250
Finished Hole Tolerance (Plated) (mils) .003 .002
Finished Hole Tolerance (Non-Plated) (mils) .002 .001
Drill Pad (Innerlayer) (mils) (IPC Class 2) DHS+14 DHS+12
Antipad (mils) DHS+16 DHS+14
Backdrill Drill Size (mils) DHS+10 DHS+7
Production Backdrill Max Stub Length (mils) (design dependent) 20 (+/-5) 14 (+/-2)
Precision Backdrill Max Stub Length (mils) N/A 10 +/- 1
Aspect Ratio (drill in mils) Finished Hole Requirement 10:[email protected] 14:[email protected]
High Temperature Lamination(LCP, Dupont TK, etc.) Yes Yes
Maximum Panel Size (inches) 24 x 36 Custom Sizes upto 24 x 54
Thickness (mils) (aspect ratio dependent) 200 250+
Finished Thickness Tolerance +/-10% +/-10%
Copper Weights (Oz. sq/ft) 1/2 Oz. - 2 Oz. 1/8 Oz. - 10 Oz.
Minimum Core Thickness (mils) .002 .001
Top/Bottom Layer Registration (mils)
LDI		 +/-1 +/-.5
Top/Bottom Layer Registration (mils) Conventional +/-3 +/-2
Innerlayer Line Width/Space (1/2 oz) (mils) 4/4 3/3
Innerlayer Line Width/Space Tolerance (1/2oz) +/-0.5mil +/-.25 mil
Impedance Tolerance +/-10% +/-5%
All Types
Materials Dupont Pyralux, Hitachi, Doosan, Panasonic, Isola, Arlon, Rogers, Taconic, Nelco, Ventec, ITEQ, GETEK, Others As Required
UL Materials, Multiple Construction/Types Approved
Surface Finishes All Finishes Supported: Tin/Lead (Reflow & HASL), ENIG, ENEPIG, Electrolytic Nickel/Gold (Hard & Soft),Immersion Tin, Immersion Silver, OSP, SMOBC
Via Types Thru, Blind, Buried, Micro, Conductive/Non-Conductive Filled
Impedance Types Microstrip, Stripline, Coplanar Waveguide
Image Process LDI, Phototool, Large Format, Bookbinder
Cross-Section & Lab Standard/Thermal Stress XS Evaluation, Structural Configuration & Integrity Analysis, Thermal Shock Chamber, Scanning Electron Microscope, MIL-PRF-31032 certified
Electrical Test All levels supported (I, II, III, IV), insertion loss/signal integrity, impedance, hi-pot, resistance, continuity, isolation, bareboard, assembly, functional (job dependent)
Certifications/Accreditations AS9100, NADCAP, MIL-PRF-31032, MIL-P-50884, MIL-P-55110, IPC-6012/6013/6018, IPC-A-600, IPC-A-610, J-STD-001,ITAR Registered, UL, Space
Full Design Service Cadence Allegro, Mentor Graphics Xpedition, Routing/Layout, Component Placement, Assembly Schematic Creation, Full Documentation Packages,Mechanical & Electrical Modeling/Simulation
Connectors In addition to Amphenols full catalog of connector products, Amphenol Printed Circuits offers three unique connector products: UHD (Ultra High Density), NAFI, Viper
Assembly Full turn-key, thru hole, press fit, crimp, SMT/BGA, Wire-Bond, RoHS compliant, potting, conformal coating, Parylene coating
Parameter
Standard Advanced
Layer Count (aspect ratio driver) 1 - 30 30+
Minimum Drill Hole Size (mechanical) (mils) (aspect ratio dependent) 7.9 <7.9
Minimum Drill Hole Size (laser) (mils) (aspect ratio dependent) 4 4
Maximum Drill Hole Size (mechanical)(mils) (larger sizes are routed) .250 .250
Finished Hole Tolerance (Plated) (mils) .003 .002
Finished Hole Tolerance (Non-Plated) (mils) .002 .001
Drill Pad (Innerlayer) (mils) (IPC Class 2) DHS+12 DHS+10
Antipad (mils) DHS+14 DHS+12
Backdrill Drill Size (mils) DHS+10 DHS+7
Production Backdrill Max Stub Length (mils) (design dependent) 12 (+/-5) 10 (+/-2)
Precision Backdrill Max Stub Length (mils) N/A 6 +/- 1
Aspect Ratio (drill in mils) Finished Hole Requirement 7:[email protected] 14:[email protected]
High Temperature Lamination(LCP, Dupont TK, etc.) Yes Yes
Maximum Panel Size (inches) 24 x 36 24 x 54
Thickness (mils) (aspect ratio dependent) 150 200+
Finished Thickness Tolerance +/-10% +/-10%
Copper Weights (Oz. sq/ft) 1/2 Oz. - 2 Oz. 1/8 Oz. - 6 Oz.
Minimum Core Thickness (mils) .005 .004
Top/Bottom Layer Registration (mils)
LDI		 +/-1 +/-.5
Top/Bottom Layer Registration (mils) Conventional +/-3 +/-2
Innerlayer Line Width/Space (1/2 oz) (mils) 4/4 3/3
Innerlayer Line Width/Space Tolerance (1/2oz) +/-0.5mil +/-.25 mil
Impedance Tolerance +/-10% +/-5%
All Types
Materials Dupont Pyralux, Hitachi, Doosan, Panasonic, Isola, Arlon, Rogers, Taconic, Nelco, Ventec, ITEQ, GETEK, Others As Required
UL Materials, Multiple Construction/Types Approved
Surface Finishes All Finishes Supported: Tin/Lead (Reflow & HASL), ENIG, ENEPIG, Electrolytic Nickel/Gold (Hard & Soft),Immersion Tin, Immersion Silver, OSP, SMOBC
Via Types Thru, Blind, Buried, Micro, Conductive/Non-Conductive Filled
Impedance Types Microstrip, Stripline, Coplanar Waveguide
Image Process LDI, Phototool, Large Format, Bookbinder
Cross-Section & Lab Standard/Thermal Stress XS Evaluation, Structural Configuration & Integrity Analysis, Thermal Shock Chamber, Scanning Electron Microscope, MIL-PRF-31032 certified
Electrical Test All levels supported (I, II, III, IV), insertion loss/signal integrity, impedance, hi-pot, resistance, continuity, isolation, bareboard, assembly, functional (job dependent)
Certifications/Accreditations AS9100, NADCAP, MIL-PRF-31032, MIL-P-50884, MIL-P-55110, IPC-6012/6013/6018, IPC-A-600, IPC-A-610, J-STD-001,ITAR Registered, UL, Space
Full Design Service Cadence Allegro, Mentor Graphics Xpedition, Routing/Layout, Component Placement, Assembly Schematic Creation, Full Documentation Packages,Mechanical & Electrical Modeling/Simulation
Connectors In addition to Amphenol's full catalog of connector products, Amphenol Printed Circuits offers three unique connector products: UHD (Ultra High Density), NAFI, Viper
Assembly Full turn-key, thru hole, press fit, crimp, SMT/BGA, Wire-Bond, RoHS compliant, potting, conformal coating, Parylene coating
Parameter
Standard Advanced
Layer Count (aspect ratio driver) 52 60+
Minimum Drill Hole Size (mechanical) (mils) (aspect ratio dependent) 7.9 < 7.9
Minimum Drill Hole Size (laser) (mils) (aspect ratio dependent) 4 4
Maximum Drill Hole Size (mechanical)(mils) (larger sizes are routed) .250 .250
Finished Hole Tolerance (Plated) (mils) .003 .002
Finished Hole Tolerance (Non-Plated) (mils) .002 .001
Drill Pad (Innerlayer) (mils) (IPC Class 2) DHS+12 DHS+10
Antipad (mils) DHS+14 DHS+12
Backdrill Drill Size (mils) DHS+10 DHS+7
Production Backdrill Max Stub Length (mils) (design dependent) 12 (+/-5) 10 (+/-2)
Precision Backdrill Max Stub Length (mils) N/A 6 +/- 1
Aspect Ratio (drill in mils) Finished Hole Requirement 17:[email protected] 22:[email protected]
High Temperature Lamination(LCP, Dupont TK, etc.) Yes Yes
Maximum Panel Size (inches) 24 x 54 36 x 42
Thickness (mils) (aspect ratio dependent) 150 440+
Finished Thickness Tolerance +/-10% +/-10%
Copper Weights (Oz. sq/ft) 1/2 Oz. - 2 Oz. 1/8 Oz. - 6 Oz.
Minimum Core Thickness (mils) .005 .004
Top/Bottom Layer Registration (mils)
LDI		 +/-1 +/-.5
Top/Bottom Layer Registration (mils) Conventional +/-3 +/-2
Innerlayer Line Width/Space (1/2 oz) (mils) 4/4 3/3
Innerlayer Line Width/Space Tolerance (1/2oz) +/-0.5mil +/-.25 mil
Impedance Tolerance +/-10% +/-5%
All Types
Materials Dupont Pyralux, Hitachi, Doosan, Panasonic, Isola, Arlon, Rogers, Taconic, Nelco, Ventec, ITEQ, GETEK, Others As Required
UL Materials, Multiple Construction/Types Approved
Surface Finishes All Finishes Supported: Tin/Lead (Reflow & HASL), ENIG, ENEPIG, Electrolytic Nickel/Gold (Hard & Soft),Immersion Tin, Immersion Silver, OSP, SMOBC
Via Types Thru, Blind, Buried, Micro, Conductive/Non-Conductive Filled
Impedance Types Microstrip, Stripline, Coplanar Waveguide
Image Process LDI, Phototool, Large Format, Bookbinder
Cross-Section & Lab Standard/Thermal Stress XS Evaluation, Structural Configuration & Integrity Analysis, Thermal Shock Chamber, Scanning Electron Microscope, MIL-PRF-31032 certified
Electrical Test All levels supported (I, II, III, IV), insertion loss/signal integrity, impedance, hi-pot, resistance, continuity, isolation, bareboard, assembly, functional (job dependent)
Certifications/Accreditations AS9100, NADCAP, MIL-PRF-31032, MIL-P-50884, MIL-P-55110, IPC-6012/6013/6018, IPC-A-600, IPC-A-610, J-STD-001,ITAR Registered, UL, Space
Full Design Service Cadence Allegro, Mentor Graphics Xpedition, Routing/Layout, Component Placement, Assembly Schematic Creation, Full Documentation Packages,Mechanical & Electrical Modeling/Simulation
Connectors In addition to Amphenol's full catalog of connector products, Amphenol Printed Circuits offers three unique connector products: UHD (Ultra High Density), NAFI, Viper
Assembly Full turn-key, thru hole, press fit, crimp, SMT/BGA, Wire-Bond, RoHS compliant, potting, conformal coating, Parylene coating