Manufacturing & Materials

  
  FLEX/RIGID-FLEX RIGID/DAUGHTERCARD  BACKPLANES 
Parameter Standard Advanced Standard Advanced Standard Advanced
Layer Count (aspect ratio driver) 22 32+ 22 32+ 52 52+
Minimum Drill Hole Size (mechanical) (mils) (aspect ratio dependent) 9.8 7.9 9.8 7.9 9.8 7.9
Minimum Drill Hole Size (laser) (mils) (aspect ratio dependent) .250 .250 .250 .250 .250 .250
Finished Hole Tolerance (Plated) (mils) .003 .002 .003 .002 .003 .002
Finished Hole Tolerance (Non-Plated) (mils) .002 .001 .002 .001 .002 .001
Drill Pad (Innerlayer) (mils) DHS+14 DHS+12 DHS+12 DHS+10 DHS+12 DHS+12
Antipad (mils) DHS+16 DHS+14 DHS+14 DHS+12 DHS+14 DHS+12
Backdrill Drill Size (mils) DHS+10 DHS+7  DHS+10 DHS+7 DHS+10 DHS+7
Production Backdrill Max Stub Length (mils) (design dependent) 20 (+/-5)  14 (+/-2) 12 (+/-5) 10 (+/-2) 12 (+/-5)  10 (+/-2)
Precision Backdrill Max Stub Length (mils)  N/A  10 +/- 1 N/A 6 +/- 1 N/A 6 +/- 1
Aspect Ratio (drill in mils) Finished Hole Requirement 10:1@7.9 14:1@9.8 7:1@7.9 14:1@7.9 17:1@15.7  22:1@15.7 
High Temperature Lamination(LCP, Dupont TK, etc.) Yes Yes Yes Yes Yes Yes
Maximum Panel Size (inches) 24 x 36 Custom sizes up to 24 x 54 24 x 36 24 x 54 24 x 54 36 x 42
Thickness (mils) (aspect ratio dependent) 200 250+ 150 200+ 150 440+
Finished Thickness Tolerance +/-10% +/-10%  +/-10% +/-10% +/-10% +/-10%
Copper Weights (Oz. sq/ft) 1/2 Oz. - 2 Oz. 1/8 Oz. - 10 Oz. 1/2 Oz. - 2 Oz. 1/8 Oz. - 5 Oz. 1/2 Oz. - 2 Oz. 1/8 Oz. - 5 Oz.
Minimum Core Thickness (mils) .002 .001 .005 .004 .005 .004
Top/Bottom Layer Registration (mils)
LDI
+/-1 +/-1 +/-1  +/-1  +/-1 +/-1 
Top/Bottom Layer Registration (mils)
Ultraspeed
 +/-2 +/-2 +/-2 +/-2 +/-2 +/-2
Top/Bottom Layer Registration (mils) Conventional +/-3 +/-3 +/-3 +/-3 +/-3 +/-3
Innerlayer Line Width/Space (1/2 oz) (mils) 4/4 3/3 4/4 3/3 4/4 3/3
Innerlayer Line Width/Space Tolerance (1/2oz) +/-0.5mil +/-.25 mil +/-0.5mil +/-.25 mil +/-0.5mil +/-.25 mil
Impedance Tolerance +/-10% +/-5% +/-10% +/-5% +/-10% +/-5%
  All Types 
Materials Dupont Pyralux, Hitachi, Doosan, Panasonic, Isola, Arlon, Rogers, Taconic, Nelco, Ventec, ITEQ, GETEK, Others As Required 
UL Materials, Multiple Construction/Types Approved
Surface Finishes All Finishes Supported: Tin/Lead (Reflow & HASL), ENIG, ENEPIG, Electrolytic Nickel/Gold (Hard & Soft),
Immersion Tin, Immersion Silver, OSP, SMOBC
 Via Types Thru, Blind, Buried, Micro, Conductive/Non-Conductive Filled 
Impedance Types Microstrip, Stripline, Coplanar Waveguide
Image Process LDI, Large Format, Boobinder
Cross-Section & Lab Standard/Thermal Stress XS Evaluation, Structural Configuration & Integrity Analysis, Thermal Shock Chamber, Scanning Electron Microscope
Electrical Test All levels supported (I, II, III, IV), insertion loss/signal integrity, impedance, hi-pot, resistance, continuity, isolation, bareboard, assembly
Certifications/Accreditations AS9100, NADCAP, MIL-PRF-31032, MIL-P-50884, MIL-P-55110, IPC-6012/6013/6018, IPC-A-600, IPC-A-610, J-STD-001, ITAR Registered, UL
Full Design Service Cadence Allegro, Mentor Graphics Expedition, Routing/Layout, Component Placement, Assembly,
Schematic Creation, Full Documentation Packages, Mechanical & Electrical Modeling/Simulation
 Connectors In addition to Amphenol's full catalog of connector products, Amphenol Printed Circuits offers three unique connector products: UHD (Ultra High Density), NAFI, Viper
 Assembly Full turn-key, thru hole, press fit, crimp, SMT/BGA, Wire-Bond, RoHS compliant, potting, conformal coating, Parylene coating
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